Patent Assignment
Reel/Frame 017098/0445
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded: 2006-01-31
Received: 2006-01-31
Pages: 3
Assignors
KIM, GEUN SIK
Executed: 2006-01-24
LEE, JAE SOO
Executed: 2006-01-24
LEE, TAESUNG
Executed: 2006-01-24
Assignee
STATS CHIPPAC LTD.
5 YISHUN STREET 23, SINGAPORE, SGX, 768442, SINGAPORE
Covered Application
(1)
INTEGRATED CIRCUIT PACKAGE SYSTEM
App. No. 11/307,313
→