Patent Assignment
Reel/Frame 017122/0954
Assignment of Assignor's Interest
Recorded: 2005-10-20
Pages: 3
Assignors
ANDERSON, STEVEN W.
Executed: 2005-10-18
MOORE, SCOTT P.
Executed: 2005-10-17
PALOMAKI, CHERYL L.
Executed: 2005-10-17
TRAN, SON K.
Executed: 2005-10-17
Assignee
ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
1701 NORTH STREET, ENDICOTT, NEW YORK, 13760
Covered Property
(1)
Method of making a circuitized substrate having a plurality of solder connection sites thereon
Application:
11/253,659 →
Publication:
US 2007/0090170
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Dec 3, 2008
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 021912/0908 →
Release by Secured Party
May 14, 2012
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
Reel/Frame 028230/0611 →
Security Agreement
May 14, 2012
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.; EI TRANSPORTATION COMPANY LLC; ENDICOTT MEDTECH, INC.
To: PNC BANK, NATIONAL ASSOCIATION
Reel/Frame 028230/0798 →
Assignment of Security Agreement
Mar 6, 2013
From: PNC BANK, NATIONAL ASSOCIATION
To: INTEGRIAN HOLDINGS, LLC
Reel/Frame 029938/0823 →