Patent Assignment
Reel/Frame 017177/0816
Assignment of Assignor's Interest
Recorded: 2006-01-11
Pages: 3
Assignor
SONY CHEMICALS CORP.
Executed: 2005-12-09
Assignee
SONY CORPORATION
7-35 KITASHINAGAWA 6-CHOME, SHINAGAWA-KU, TOKYO 141-0001, JAPAN
Covered Property
(1)
Method for Manufacturing a Bump-Attached Wiring Circuit Board
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.