Patent Assignment
Reel/Frame 017225/0814
Assignment of Assignor's Interest
Recorded: 2006-02-01
Pages: 4
Assignors
LEE, JAE-GAB
Executed: 2006-01-24
JEONG, CHANG-OH
Executed: 2006-01-24
SUNG, MYUNG-MO
Executed: 2006-01-24
YANG, HEE-JUNG
Executed: 2006-01-24
CHO, BEOM-SEOK
Executed: 2006-01-24
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Thin Film Transistor Substrate and Method for Forming Metal Wire Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.