Patent Assignment
Reel/Frame 017228/0274
Assignment of Assignor's Interest
Recorded: 2005-11-10
Pages: 3
Assignor
SEKO, TOSHIHARU
Executed: 2005-10-27
Assignee
SHARP KABUSHIKI KAISHA
22-22 NAGAIKE-CHO ABENO-KU, OSAKA-SHI, OSAKA, 545-8522, JAPAN
Covered Property
(1)
Flexible Wiring Substrate, Semiconductor Device and Electronic Device Using Flexible Wiring Substrate, and Fabricating Method of Flexible Wiring Substrate
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.