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Patent Assignment
Reel/Frame 017287/0548

ASSIGNMENT OF ASSIGNOR'S INTEREST

Recorded: 2006-03-10 Received: 2006-03-10 Pages: 5
Assignors
CHOW, SENG GUAN
Executed: 2006-02-09
DIMAANO, JR., ANTONIO B.
Executed: 2006-02-09
HO, TSZ YIN
Executed: 2006-02-09
KUAN, HEAP HOE
Executed: 2006-02-09
MERILO, DIOSCORO A.
Executed: 2006-02-09
Assignee
STATS CHIPPAC LTD.
5 YISHUN STREET 23, SINGAPORE, SGX, 768442, SINGAPORE
Covered Applications (2)
INTEGRATED CIRCUIT PACKAGE ON PACKAGE SYSTEM
App. No. 11/276,646
→
MULTI-CHAMBER CONTAINER AND CAP THEREFOR
App. No. 11/267,424
→