IP Library › Assignment 017322/0509
Patent Assignment
Reel/Frame 017322/0509

Assignment of Assignor's Interest

Recorded: 2005-12-05 Pages: 2
Assignors
ITATANI, OSAMU
Executed: 2005-10-06
SAGAWA, MASATO
Executed: 2005-10-07
Assignee
INTERMETALLICS CO., LTD.
22-1, OIAGE-CHO, MATSUMURO, NISHIKYO-KU, KYOTO-SHI, KYOTO 615-8206, JAPAN
Covered Property (1)
Method for Forming Adhesive Layer
Patent: 7,354,621 →
Application: 10/559,435 →
Publication: US 2006/0134319
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address Mar 25, 2020
From: INTERMETALLICS CO., LTD.
To: INTERMETALLICS CO., LTD.
Reel/Frame 052220/0541 →
Change of Address Mar 25, 2020
From: INTERMETALLICS CO., LTD.
To: INTERMETALLICS CO., LTD.
Reel/Frame 052220/0705 →
Assignment of Assignor's Interest Mar 25, 2020
From: INTERMETALLICS CO., LTD.
To: DAIDO STEEL CO., LTD.
Reel/Frame 052220/0828 →