Patent Assignment
Reel/Frame 017354/0890
Assignment of Assignor's Interest
Recorded: 2005-06-07
Pages: 2
Assignors
TANAKA, SHIGERU
Executed: 2005-05-16
ITOH, TAKASHI
Executed: 2005-05-16
NISHINAKA, MASARU
Executed: 2005-05-16
SHIMO-OHSAKO, KANJI
Executed: 2005-05-16
MURAKAMI, MUTSUAKI
Executed: 2005-05-16
Assignee
KANEKA CORPORATION
2-4, NAKANOSHIMA 3-CHOME, KITA-KU, OSAKA-SHI, OSAKA 530-8288, JAPAN
Covered Property
(1)
Thermoplastic Polyimide Resin Film, Multilayer Body and Method for Manufacturing Printed Wiring Board Composed of Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.