Patent Assignment
Reel/Frame 017369/0096
Assignment of Assignor's Interest
Recorded: 2005-12-13
Pages: 7
Assignors
LEE, HI-KUK
Executed: 2005-12-07
YUKO, YAKO
Executed: 2005-12-07
LEE, DONG-KI
Executed: 2005-12-07
KIM, KYU-YOUNG
Executed: 2005-12-07
Assignees
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
SUMITOMO CHEMICAL CO., LTD.
27-1, SHINAKAWA 2-CHOME, CHUO-KU, TOKYO 104-8260, JAPAN
Covered Property
(1)
Photosensitive Resin Composition, Thin Film Panel Made with Photosensitive Resin Composition, and Method for Manufacturing Thin Film Panel
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.