Patent Assignment
Reel/Frame 017398/0206
Assignment of Assignor's Interest
Recorded: 2005-12-29
Pages: 4
Assignee
MOTOROLA, INC.
1303 E. ALGONQUIN, LAW DEPARTMENT IL01 - 3RD FLOOR, SCHAUMBURG, ILLINOIS, 60196
Covered Property
(1)
Wafer-Level Sealed Microdevice Having Trench Isolation and Methods for Making the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.