Patent Assignment
Reel/Frame 017399/0883
Assignment of Assignor's Interest
Recorded: 2005-12-21
Pages: 2
Assignee
RENESAS TECHNOLOGY CORP.
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Packaging Device Comprising a Semiconductor Chip Including a Mosfet
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.