Patent Assignment
Reel/Frame 017404/0588
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded: 2006-04-01
Received: 2006-04-01
Pages: 4
Assignors
JU, JONG WOOK
Executed: 2006-03-16
KIM, HYUN JOUNG
Executed: 2006-03-16
LIM, TAEG KI
Executed: 2006-03-16
Assignee
STATS CHIPPAC LTD.
5 YISHUN STREET 23, SINGAPORE, SGX, 768442, SINGAPORE
Covered Application
(1)
STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CONNECTION PROTECTION
App. No. 11/278,421
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