Patent Assignment
Reel/Frame 017442/0667
Assignment of Assignor's Interest
Recorded: 2005-12-01
Pages: 23
Assignors
ALHAYEK, IYAD
Executed: 2005-11-18
BIANCO, GERRY
Executed: 2005-11-18
BROSZEIT, JUERGEN
Executed: 2005-11-23
GAYOWSKY, GREGORY R.
Executed: 2005-11-18
SCHMADLAK, IIKO
Executed: 2005-11-21
SOTIROPOULOS, GEORGE
Executed: 2005-11-18
Assignee
MOTOROLA, INC.
1303 E. ALGONQUIN ROAD, LAW DEPARTMENT IL01 - 3RD FLOOR, SCHAUMBURG, ILLINOIS, 60196
Covered Property
(1)
Integrated Circuit Mounting for Thermal Stress Relief Useable in a Multi-Chip Module
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.