Patent Assignment
Reel/Frame 017469/0857
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded: 2006-04-13
Received: 2006-04-13
Pages: 3
Assignor
PENDSE, RAJENDRA D.
Executed: 2006-04-10
Assignee
STATS CHIPPAC LTD.
5 YISHUN STREET 23, SINGAPORE, SGX, 768442, SINGAPORE
Covered Application
(1)
INTEGRATED CIRCUIT PACKAGE SYSTEM
App. No. 11/279,741
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