Patent Assignment
Reel/Frame 017489/0246
Assignment of Assignor's Interest
Recorded: 2006-01-20
Pages: 2
Assignors
MAKI, HIROSHI
Executed: 2005-12-26
SEIKI, KAZUHIRO
Executed: 2005-12-26
WADA, EIJI
Executed: 2005-12-27
Assignee
RENESAS TECHNOLOGY CORP.
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Manufacturing Method of Die-Pick-Up from Wafer
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.