Patent Assignment
Reel/Frame 017506/0892
Assignment of Assignor's Interest
Recorded: 2006-04-20
Pages: 5
Assignors
FU, WAI B.
Executed: 2006-03-17
LAM, HIEU
Executed: 2006-04-04
MEHDIZADEH, SHAHRAM Y.
Executed: 2006-03-21
WONG, YEAK-CHONG
Executed: 2006-04-04
Assignee
HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V.
LOCATELLIKADE 1, PARNASSUSTOREN, AMSTERDAM, 1076 AZ, NETHERLANDS
Covered Property
(1)
Controlling the Thickness of Wafers During the Electroplating Process
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.