Patent Assignment
Reel/Frame 017559/0467
Assignment of Assignor's Interest
Recorded: 2006-05-01
Pages: 3
Assignors
BASHEER, RAFIL A.
Executed: 2006-04-07
WORKMAN, DEREK B.
Executed: 2006-04-25
CHAUDHURI, ARUN K.
Executed: 2006-04-25
BOUGUETTAYA, MOHAMED
Executed: 2006-04-07
Assignee
DELPHI TECHNOLOGIES, INC.
P.O. BOX 5052, LEGAL STAFF-MAIL CODE: 480-410-202, TROY, MICHIGAN
Covered Property
(1)
Methods of making a curable composition having low coefficient of thermal expansion and an integrated circuit and a curable composition and integrated circuit made there from
Application:
11/317,661 →
Publication:
US 2006/0199301
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.