IP Library › Assignment 017571/0922
Patent Assignment
Reel/Frame 017571/0922

Assignment of Assignor's Interest

Recorded: 2006-05-03 Pages: 8
Assignors
TSUMURA, MANABU
Executed: 2005-10-27
IDE, MASAHITO
Executed: 2005-10-27
OUCHI, KATSUYA
Executed: 2005-10-27
KURAMOTO, MASAFUMI
Executed: 2005-10-27
MIKI, TOMOHIDE
Executed: 2005-10-27
Assignees
KANEKA CORPORATION
2-4, NAKANOSHIMA, 3-CHOME, KITA-KU, OSAKA-SHI, OSAKA 530-8288, JAPAN
NICHIA CORPORATION
OKA, KAMINAKACHO, 491-100, ANAN-SHI, TOKUSHIMA, 774-8601, JAPAN
Covered Property (1)
Curable Composition and Method of Preparing Same, Light-Shielding Paste, Light-Shielding Resin and Method of Forming Same, Light-Emitting Diode Package and Semiconductor Device
Patent: 7,785,715 →
Application: 10/546,905 →
Publication: US 2006/0243947
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 3, 2006
From: TSUMURA-MANABU; IDE, MASAHITO; OUCHI, KATSUYA; KURAMOTO, MASAFUMI
To: KANEKA CORPORATION; NICHIA CORPORATION
Reel/Frame 017571/0912 →
Change of Address Jan 15, 2014
From: KANEKA CORPORATION
To: KANEKA CORPORATION
Reel/Frame 032019/0901 →