IP Library › Assignment 017601/0067
Patent Assignment
Reel/Frame 017601/0067

Assignment of Assignor's Interest

Recorded: 2006-02-21 Pages: 2
Assignor
CHOU, CHEN-JEAN
Executed: 2006-02-16
Assignee
QUALCOMM MEMS TECHNOLOGIES, INC.
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121
Covered Property (1)
Method for Providing and Removing Discharging Interconnect for Chip-on-Glass Output Leads and Structures Thereof
Patent: 7,582,952 →
Application: 11/358,997 →
Publication: US 2007/0194414
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 27, 2007
From: QUALCOMM MEMS TECHNOLOGIES, INC.
To: QUALCOMM INCORPORATED
Reel/Frame 019493/0860 →
Assignment of Assignor's Interest Feb 27, 2008
From: QUALCOMM INCORPORATED
To: QUALCOMM MEMS TECHNOLOGIES, INC.
Reel/Frame 020571/0253 →
Assignment of Assignor's Interest Aug 31, 2016
From: QUALCOMM MEMS TECHNOLOGIES, INC.
To: SNAPTRACK, INC.
Reel/Frame 039891/0001 →