Patent Assignment
Reel/Frame 017635/0120
Assignment of Assignor's Interest
Recorded: 2006-05-16
Pages: 2
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA 211-8668, JAPAN
Covered Property
(1)
Plating process and manufacturing process for semiconductor device thereby, and plating apparatus
Application:
11/408,172 →
Publication:
US 2006/0237319
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.