IP Library › Assignment 017646/0870
Patent Assignment
Reel/Frame 017646/0870

Assignment of Assignor's Interest

Recorded: 2006-03-08 Pages: 3
Assignors
HAN, SANG JIN
Executed: 2006-03-03
LEE, SUNG HO
Executed: 2006-03-03
HUH, MYUNG SOO
Executed: 2006-03-03
JEONG, SEOK HEON
Executed: 2006-03-03
SONG, KWAN SEOP
Executed: 2006-03-03
KANG, HEE CHEOL
Executed: 2006-03-03
Assignee
SAMSUNG SDI CO., LTD.
575, SHIN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Chuck Plate Assembly with Cooling Means
Patent: 7,548,304 →
Application: 11/298,566 →
Publication: US 2006/0154407
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 15, 2008
From: SAMSUNG SDI CO., LTD.
To: SAMSUNG MOBILE DISPLAY CO., LTD.
Reel/Frame 022024/0026 →
Merger Aug 29, 2012
From: SAMSUNG MOBILE DISPLAY CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 028868/0955 →