IP Library › Assignment 017654/0786
Patent Assignment
Reel/Frame 017654/0786

Assignment of Assignor's Interest

Recorded: 2005-08-26 Pages: 2
Assignors
NAKAI, TAKASHI
Executed: 2005-07-25
KAWASE, KINYA
Executed: 2005-07-25
Assignee
MITSUBISHI MATERIALS CORPORATION
5-1, OHTEMACHI 1-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property (1)
Powder Molding Die Apparatus and Method of Molding for Obtaining Powder Molding Product
Patent: 7,585,165 →
Application: 10/547,047 →
Publication: US 2006/0147570
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 13, 2006
From: MITSUBISHI MATERIALS CORPORATION
To: MITSUBISHI MATERIALS PMG CORPORATION
Reel/Frame 017458/0856 →
Change of Name Dec 29, 2009
From: MITSUBISHI MATERIALS PMG CORPORATION
To: DIAMET CORPORATION
Reel/Frame 023708/0362 →