IP Library › Assignment 017750/0385
Patent Assignment
Reel/Frame 017750/0385

Assignment of Assignor's Interest

Recorded: 2006-03-31 Pages: 2
Assignors
KURITA, YOICHIRO
Executed: 2006-03-16
KAWANO, MASAYA
Executed: 2006-03-16
SOEJIMA, KOJI
Executed: 2006-03-16
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE NAKAHARA-KU, KAWASAKI, KANAGAWA 211-8668, JAPAN
Covered Property (1)
Method of Forming Metal Interconnect Layers for Flip Chip Device
Patent: 7,927,999 →
Application: 11/393,686 →
Publication: US 2006/0226556
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 4, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025311/0833 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →