Patent Assignment
Reel/Frame 017750/0404
Assignment of Assignor's Interest
Recorded: 2006-04-04
Pages: 3
Assignors
MOROZUMI, AKIRA
Executed: 2006-03-02
SOYANO, SHIN
Executed: 2006-03-02
TAKAHASHI, YOSHIKAZU
Executed: 2006-03-09
Assignee
FUJI ELECTRIC DEVICE TECHNOLOGY CO., LTD.
11-2, OSAKI 1-CHOME, SHINAGAWA-KU, TOKYO 141-0032, JAPAN
Covered Property
(1)
Solder alloy and a semiconductor device using the solder alloy
Application:
11/345,516 →
Publication:
US 2006/0263235
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.