Assignment of Assignor's Interest

Recorded: 2006-04-07 Pages: 3

Assignor

YOU, CHUN GI

Executed: 2006-03-30

Assignee

SAMSUNG ELECTRONICS CO., LTD.

416 MAETAN-DONG YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF

Covered Property (1)

Thin film transistor substrate with improved inter-layer adhesion

Application: 11/399,766 →

Publication: US 2007/0085939

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.