Patent Assignment
Reel/Frame 017806/0271
Assignment of Assignor's Interest
Recorded: 2006-06-19
Pages: 3
Assignors
PLOESSL, ANDREAS
Executed: 2006-05-18
ILLEK, STEFAN
Executed: 2006-05-19
GROLIER, VINCENT
Executed: 2006-05-23
Assignee
OSRAM OPTO SEMICONDUCTORS GMBH
WERNERWERKSTRASSE 2, REGENSBURG, 93049, GERMANY
Covered Property
(1)
Semiconductor Chip Having a Soldering Layer Sequence, and Process for Soldering a Semiconductor Chip
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.