Patent Assignment
Reel/Frame 017811/0253
Assignment of Assignor's Interest
Recorded: 2006-06-20
Received: 2006-06-20
Pages: 4
Assignor
NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
Executed: 2006-03-17
Assignee
NEC ELECTRONICS CORPORATION
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, JPX, 211-8668, JAPAN
Covered Property
(1)
Method and Apparatus for Depositing a Thin Film, and Semiconductor Device Having a Semiconductor-Insulator Junction
Application:
10/041,609 →