IP Library Assignment 017832/0361
Patent Assignment
Reel/Frame 017832/0361

Assignment of Assignor's Interest

Recorded: 2005-10-11 Pages: 2
Assignors
TANAKA, SHIGERU
Executed: 2005-09-30
SHIMOOHSAKO, KANJI
Executed: 2005-09-30
ITOH, TAKASHI
Executed: 2005-09-30
OKADA, KOJI
Executed: 2005-09-30
MURAKAMI, MUTSUAKI
Executed: 2005-09-30
Assignee
KANEKA CORPORATION
2-4, NAKANOSHIMA 3-CHOME, KITA-KU, OSAKA-SHI, OSAKA 530-8288, JAPAN
Covered Property (1)
Thermosetting Resin Composition, Multilayer Body Using Same, and Circuit Board
Patent: 7,521,511 →
Application: 10/552,540 →
Publication: US 2006/0205891
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address Jan 15, 2014
From: KANEKA CORPORATION
To: KANEKA CORPORATION
Reel/Frame 032019/0901 →