Patent Assignment
Reel/Frame 017860/0503
Assignment of Assignor's Interest
Recorded: 2006-05-03
Pages: 2
Assignors
KWON, KI-HWAN
Executed: 2006-04-24
SHIN, KYU-HO
Executed: 2006-04-24
KWEON, SOON-CHEOL
Executed: 2006-04-24
MOON, CHANG-YOUL
Executed: 2006-04-24
DARBINIAN, ARTHUR
Executed: 2006-04-24
CHOI, SEUNG-TAE
Executed: 2006-04-24
SHIN, SU-HO
Executed: 2006-04-24
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Led Package and Fabrication Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.