Patent Assignment
Reel/Frame 017902/0141
Assignment of Assignor's Interest
Recorded: 2006-05-15
Pages: 2
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Method of Manufacturing a Solid-State Image-Sensing Device Including Filling Up a Gap with Insulating Resin, and Solid-State Image-Sensing Device
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.