IP Library › Assignment 017905/0469
Patent Assignment
Reel/Frame 017905/0469

ASSIGNMENT OF ASSIGNOR'S INTEREST

Recorded: 2006-07-10 Received: 2006-07-10 Pages: 3
Assignor
LEE, YOUNG GUE
Executed: 2006-06-19
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, SGX, 569059, SINGAPORE
Covered Applications (3)
AUTODETECT FEATURE FOR A SPACEWIRE APPLICATION
App. No. 11/456,488
→
STACKED SEMICONDUCTOR PACKAGE ASSEMBLY HAVING HOLLOWED SUBSTRATE
App. No. 11/420,873
→
Stacked semiconductor package assembly having hollowed substrate
App. No. 60/686,283
→