Patent Assignment
Reel/Frame 017923/0147
Assignment of Assignor's Interest
Recorded: 2006-05-22
Pages: 3
Assignors
LEE, HSIAO-WEN
Executed: 2006-05-16
ZUNG, PETER
Executed: 2006-05-16
LIN, TZU-HAN
Executed: 2006-05-16
LIN, TZY-VING
Executed: 2006-05-16
CHANG, CHIA-YANG
Executed: 2006-05-16
LIN, CHIEN-PANG
Executed: 2006-05-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8. LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, R.O.C., TAIWAN
Covered Property
(1)
Optoelectronic Device Chip Having a Composite Spacer Structure and Method Making Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 5, 2006
From: LEE, HSIAO-WEN; ZUNG, PETER; LIN, TZU-HAN; LIN, TZY-VING
To: VISERA TECHNOLOGIES COMPANY LTD
Reel/Frame 021385/0662 →
Assignment of Assignor's Interest
Jul 8, 2011
From: VISERA TECHNOLOGIES COMPANY LIMITED
To: OMNIVISION TECHNOLOGIES, INC.
Reel/Frame 026563/0895 →
Corrective Assignment to Correct the Assignee Previously Recorded on Reel 026563 Frame 0895. Assignor(S) Hereby Confirms the Assignees Are Omnivision Technologies, Inc. and Visera Technologies Company Limited.
Aug 11, 2011
From: VISERA TECHNOLOGIES COMPANY LIMITED
To: OMNIVISION TECHNOLOGIES, INC.; VISERA TECHNOLOGIES COMPANY LIMITED
Reel/Frame 026736/0545 →