Patent Assignment
Reel/Frame 017933/0792
Assignment of Assignor's Interest
Recorded: 2006-07-14
Pages: 2
Assignors
TAKENAKA, TOSHIAKI
Executed: 2006-02-14
KAWAKITA, YOSHIHIRO
Executed: 2006-02-14
TOJYO, TADASHI
Executed: 2006-02-15
SUGITA, YUICHIRO
Executed: 2006-02-14
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property
(1)
Method of Manufacturing Multi-Layer Circuit Board
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.