Patent Assignment
Reel/Frame 017943/0068
Assignment of Assignor's Interest
Recorded: 2006-05-31
Received: 2006-06-05
Pages: 4
Assignors
FAN, CHUN HO
Executed: 2002-04-03
MCLELLAN, NEIL ROBERT
Executed: 2002-04-03
NG, HAU WAN
Executed: 2002-04-03
COMBS, EDWARD G.
Executed: 2002-04-15
PUN, TAI WAI
Executed: 2002-04-15
SHEPPARD, ROBERT P.
Executed: 2002-04-15
Assignee
ASAT LIMITED
QPL INDUSTRIAL BUILDING, 138 TEXACO ROAD, TSUEN WAN, NEW TERRITORIES, HKX, HONG KONG
Covered Property
(1)
Method of manufacturing enhanced thermal dissipation integrated circuit package
Application:
11/367,708 →