Patent Assignment
Reel/Frame 017984/0853
Assignment of Assignor's Interest
Recorded: 2006-07-24
Pages: 2
Assignors
CHUNG, KWOK KEE
Executed: 2006-07-14
LAM, KUI KAM
Executed: 2006-07-14
LEUNG, CHI KEUNG
Executed: 2006-07-14
CHEUNG, WAI YUEN
Executed: 2006-07-14
Assignee
ASM ASSEMBLY AUTOMATION LTD.
20/F., WATSON CENTRE, 16-22 KUNG YIP ST.,, KWAI CHUNG, HONG KONG, CHINA
Covered Property
(1)
Automatic Level Adjustment for Die Bonder
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.