Patent Assignment
Reel/Frame 018011/0388
Assignment of Assignor's Interest
Recorded: 2006-07-27
Received: 2006-07-27
Pages: 3
Assignor
LIN, MOU-SHIUNG
Executed: 2006-03-01
Assignee
MEGIC CORPORATION
21 R&D FIRST ROAD, SCIENCE BASED INDUSTRIAL PARK, HSIN-CHU, TWX, TAIWAN
Covered Property
(1)
High performance IC chip having discrete decoupling capacitors attached to its IC surface
Application:
60/455,154 →