Patent Assignment
Reel/Frame 018061/0280
Assignment of Assignor's Interest
Recorded: 2006-07-05
Pages: 5
Assignee
RENESAS TECHNOLOGY CORP.
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Properties
(9)
Semiconductor Integrated Circuit Device and Process for Manufacturing the Same
Patent:
5,754,467 →
Application:
08/451,117 →
Semiconductor Integrated Circuit Device and Process for Manufacturing the Same
Patent:
5,946,565 →
Application:
08/880,736 →
Semiconductor Integrated Circuit Device and Process for Manufacturing the Same
Patent:
6,211,004 →
Application:
09/334,266 →
Semiconductor Integrated Circuit Device and Process for Manufacturing the Same
Semiconductor Integrated Circuit Device and Process for Manufacturing the Same
Semiconductor Integrated Circuit Device and Process for Manufacturing the Same
Semiconductor Integrated Circuit Device and Process for Manufacturing the Same
Semiconductor Integrated Circuit Device and Process for Manufacturing the Same
Semiconductor Integrated Circuit Device and Process for Manufacturing the Same
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 23, 1997
From: IKEDA, SHUJI; YAMANAKA, TOSHIAKI; KIKUSHIMA, KENICHI; MITANI, SHINICHIRO
To: HITACHI, LTD.
Reel/Frame 008598/0702 →
Assignment of Assignor's Interest
Sep 26, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014570/0380 →
Merger
Jul 30, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025204/0512 →