IP Library Assignment 018125/0945
Patent Assignment
Reel/Frame 018125/0945

Assignment of Assignor's Interest

Recorded: 2006-08-15 Pages: 3
Assignors
CHUNG, YONG-BOK
Executed: 2006-07-06
CHO, JEONG-HO
Executed: 2006-07-06
Assignee
SAMSUNG TECHWIN CO., LTD.
28 SUNGJU-DONG, CHANGWON-CITY, KYONGSANGNAM-DO, KOREA, REPUBLIC OF
Covered Property (1)
Method of Correcting Bonding Coordinates Using Reference Bond Pads
Patent: 7,817,846 →
Application: 11/485,488 →
Publication: US 2007/0230771
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Sep 29, 2015
From: SAMSUNG TECHWIN CO., LTD.
To: HANWHA TECHWIN CO., LTD.
Reel/Frame 036714/0757 →
Corrective Assignment to Correct the Receiving Party Address Previously Recorded at Reel: 036714 Frame: 0757. Assignor(S) Hereby Confirms the Change of Name. Nov 9, 2015
From: SAMSUNG TECHWIN CO., LTD.
To: HANWHA TECHWIN CO., LTD.
Reel/Frame 037072/0008 →