IP Library › Assignment 018167/0454
Patent Assignment
Reel/Frame 018167/0454

Assignment of Assignor's Interest

Recorded: 2006-08-24 Pages: 3
Assignors
BAUER, MICHAEL
Executed: 2006-07-12
CHAN, KAI CHONG
Executed: 2006-08-13
Assignee
INFINEON TECHNOLOGIES AG
ST.-MARTIN-STR. 53, MUNICH, 81669, GERMANY
Covered Property (1)
Panel and Semiconductor Component Having a Composite Board with Semiconductor Chips and Plastic Package Molding Compound and Method for the Production Thereof
Patent: 7,619,304 →
Application: 11/445,358 →
Publication: US 2006/0278972
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 18, 2012
From: INFINEON TECHNOLOGIES AG
To: INTEL MOBILE COMMUNICATIONS TECHNOLOGY GMBH
Reel/Frame 027548/0623 →
Assignment of Assignor's Interest Jan 19, 2012
From: INTEL MOBILE COMMUNICATIONS TECHNOLOGY GMBH
To: INTEL MOBILE COMMUNICATIONS GMBH
Reel/Frame 027556/0709 →
Change of Name Nov 6, 2015
From: INTEL MOBILE COMMUNICATIONS GMBH
To: INTEL DEUTSCHLAND GMBH
Reel/Frame 037057/0061 →
Assignment of Assignor's Interest Aug 29, 2022
From: INTEL DEUTSCHLAND GMBH
To: INTEL CORPORATION
Reel/Frame 061356/0001 →