Patent Assignment
Reel/Frame 018204/0534
Assignment of Assignor's Interest
Recorded: 2006-08-17
Pages: 2
Assignors
KANG, SUNG-GYU
Executed: 2006-08-16
LIM, SEUNG-MO
Executed: 2006-08-16
LEE, JAE-CHANG
Executed: 2006-08-16
KIM, WOON-BAE
Executed: 2006-08-16
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Silicon Direct Bonding Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.