Patent Assignment
Reel/Frame 018207/0769
Assignment of Assignor's Interest
Recorded: 2006-09-08
Pages: 3
Assignor
DELAWARE CAPITAL FORMATION, INC.
Executed: 2002-01-22
Assignee
DEK INTERNATIONAL GMBH
GEROLDSTRASSE 28, ZURICH, 8005, SWITZERLAND
Covered Properties
(2)
Method and Apparatus for Balling and Assembling Ball Grid Array and Chip Scale Array Packages
Patent:
6,484,927 →
Application:
09/434,468 →
Method and apparatus for balling and assembling ball grid array and chip scale array packages
Application:
09/837,728 →
Publication:
US 2002/0092886
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Corrective Assignment
Oct 20, 2005
From: UNIVERSAL INSTRUMENTS CORPORATION
To: DELAWARE CAPITAL FORMATION
Reel/Frame 016918/0457 →
Corrective Assignment to Correct List of Patent Application Numbers on Schedue a Recorded at Reel 016918, Frame 0457.
Apr 11, 2006
From: UNIVERSAL INSTRUMENTS CORPORATION
To: DELAWARE CAPITAL FORMATION
Reel/Frame 017470/0467 →
Change of Name
Jul 17, 2013
From: DEK INTERNATIONAL GMBH
To: DTG INTERNATIONAL GMBH
Reel/Frame 030813/0022 →
Correct a Typographical Error Made in a Previously Recorded Document That Erroneously Affects the Identified Applications
Aug 21, 2013
From: DEK INTERNATIONAL GMBH
To: DTG INTERNATIONAL GMBH
Reel/Frame 031074/0848 →
Change of Name
Jun 5, 2015
From: DTG INTERNATIONAL GMBH
To: ASM ASSEMBLY SYSTEMS SWITZERLAND GMBH
Reel/Frame 035793/0164 →
Assignment of Assignor's Interest
Jun 26, 2017
From: ASM ASSEMBLY SYSTEMS SWITZERLAND GMBH
To: ASM ASSEMBLY SYSTEMS SINGAPORE PTE. LTD.
Reel/Frame 042808/0199 →