IP Library Assignment 018215/0284
Patent Assignment
Reel/Frame 018215/0284

Assignment of Assignor's Interest

Recorded: 2006-09-07 Pages: 6
Assignors
NOQUIL, JONATHAN A.
Executed: 2004-07-16
CHOI, SEUNG-YONG
Executed: 2004-07-16
JOSHI, RAJEEV D.
Executed: 2004-07-19
WU, CHUNG-LIN
Executed: 2004-07-19
Assignee
FAIRCHILD SEMICONDUCTOR CORPORATION
82 RUNNING HILL ROAD, MS 35-4C, SOUTH PORTLAND, MAINE, 04106
Covered Property (1)
Multi-Flip Chip on Lead Frame on Over Molded Ic Package and Method of Assembly
Patent: 7,154,186 →
Application: 10/803,464 →
Publication: US 2005/0206010
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 3, 2021
From: FAIRCHILD SEMICONDUCTOR CORPORATION
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 057694/0374 →