Patent Assignment
Reel/Frame 018219/0502
Assignment of Assignor's Interest
Recorded: 2006-08-22
Pages: 2
Assignors
ASADA, SHINSUKE
Executed: 2006-07-14
NAKAMURA, HIROSHI
Executed: 2006-07-14
TARUYA, MASAAKI
Executed: 2006-07-14
Assignee
MITSUBISHI ELECTRIC CORP.
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO 100-8310, JAPAN
Covered Property
(1)
Seminconductor Pressure Sensor and Die for Molding a Semiconductor Pressure Sensor
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.