Patent Assignment
Reel/Frame 018219/0910
Assignment of Assignor's Interest
Recorded: 2006-08-24
Pages: 3
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Insulating Layer Between Bumps of Semiconductor Chip, and Display Panel Using the Same with Anisotropic Conductive Film Between Semiconductor Chip and Substrate
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.