Patent Assignment
Reel/Frame 018252/0081
Assignment of Assignor's Interest
Recorded: 2006-08-29
Pages: 2
Assignor
BAI, KEUN-HEE
Executed: 2006-08-10
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Etching Carbon-Containing Layer and Method of Fabricating Semiconductor Device