Patent Assignment
Reel/Frame 018289/0981
Assignment of Assignor's Interest
Recorded: 2006-09-08
Pages: 2
Assignors
LEE, JOO-HO
Executed: 2006-08-18
PARK, HAE-SEOK
Executed: 2006-08-18
SONG, IN-SANG
Executed: 2006-08-18
HA, BYEOUNG-JU
Executed: 2006-08-18
HONG, SEOG-WOO
Executed: 2006-08-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
System on Chip Structure Comprising Air Cavity for Isolating Elements, Duplexer, and Duplexer Fabrication Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.