IP Library Assignment 018336/0361
Patent Assignment
Reel/Frame 018336/0361

Assignment of Assignor's Interest

Recorded: 2006-09-29 Pages: 4
Assignor
ZHAO, YANG
Executed: 2005-09-28
Assignee
MEMSIC, INC.
800 TURNPIKE STREET, SUITE 202, NORTH ANDOVER, MASSACHUSETTS, 01845
Covered Property (1)
Chip-Scale Package for Integrated Circuits
Patent: 7,295,029 →
Application: 11/242,296 →
Publication: US 2006/0216857
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 21, 2021
From: MEMSIC INC.
To: MEMSIC SEMICONDUCTOR (TIANJIN) CO., LTD.
Reel/Frame 056308/0918 →