IP Library Assignment 018378/0688
Patent Assignment
Reel/Frame 018378/0688

Assignment of Assignor's Interest

Recorded: 2006-10-04 Pages: 3
Assignors
TANAKA, SHIGERU
Executed: 2006-09-05
SHIMOOHSAKO, KANJI
Executed: 2006-09-05
ITO, TAKASHI
Executed: 2006-09-05
MURAKAMI, MUTSUAKI
Executed: 2006-09-05
Assignee
KANEKA CORPORATION
2-4, NAKANOSHIMA 3-CHOME, KITA-KU, OSAKA-SHI, OSAKA 530-8288, JAPAN
Covered Property (1)
Thermosetting Resin Composition, Laminated Body Using It, and Circuit Board
Patent: 8,067,523 →
Application: 11/542,229 →
Publication: US 2007/0074896
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address Jan 15, 2014
From: KANEKA CORPORATION
To: KANEKA CORPORATION
Reel/Frame 032019/0901 →