IP Library Assignment 018394/0304
Patent Assignment
Reel/Frame 018394/0304

Assignment of Assignor's Interest

Recorded: 2006-10-10 Pages: 5
Assignors
HEBEL, DANIEL JUSTIN
Executed: 2006-08-08
GAW, CLIFFORD ALLEN
Executed: 2006-08-08
RAMAIYA, BRINDA KUMAR
Executed: 2006-08-10
RUTLEDGE, JAMES STEPHEN
Executed: 2006-08-11
Assignee
LENOVO (SINGAPORE) PTE. LTD,
151 LORONG CHUAN, #02-01 NEW TECH PARK, SINGAPORE, 556741, SINGAPORE
Covered Property (1)
Integrated Circuit Chip Thermal Solution
Patent: 7,903,425 →
Application: 11/475,532 →
Publication: US 2007/0297155
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Nunc Pro Tunc Assignment Nov 25, 2015
From: LENOVO (SINGAPORE) PTE LTD.
To: LENOVO PC INTERNATIONAL
Reel/Frame 037160/0001 →
Assignment of Assignor's Interest Jan 10, 2025
From: LENOVO PC INTERNATIONAL LIMITED
To: LENOVO SWITZERLAND INTERNATIONAL GMBH
Reel/Frame 069870/0670 →