Patent Assignment
Reel/Frame 018429/0172
Assignment of Assignor's Interest
Recorded: 2006-10-17
Pages: 2
Assignor
TSURUGIDA, YOSHIROU
Executed: 2006-09-29
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Method for manufacturing a semiconductor wafer,including a plurality of etching and ozone water cleaning steps
Application:
11/581,455 →
Publication:
US 2007/0093065
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.